PN Type Package Designator Pb-Free Packages - Manufacturing Conversion Datecode, Refer to Note 1 Type of Plating / Finish Matte Tin Annealing Process Minimum Plating Thickness Does this Microchip Pb-free device meet RoHS compliance for the following 6 materials: Pb, Hg, Cr6+, Cd, and PBB / PBDE Total Mass (g) STANDARD3L SOT-89 0508Matte Tin150C / 1hr w/l 24 hours400 microinchesYes0.0489
MCP1700T-5002E/MB |
RFQ for MCP1700T-5002E/MB |
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| Technical/Catalog Information | MCP1700T-5002E/MB |
| Vendor | Microchip Technology |
| Category | Integrated Circuits (ICs) |
| Regulator Type | Single Output |
| Package / Case | SOT-89-3 |
| Packaging | Tape & Reel (TR) |
| Regulator Topology | Positive Fixed |
| Current - Output | 200mA |
| Voltage - Output | 5V |
| Operating Temperature | -40°C ~ 125°C |
| Voltage - Input | 2.3 ~ 6 V |
| Number of Regulators | 1 |
| Current - Limit (Min) | - |
| Current Short Circuit (Isc) | 408mA |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | MCP1700T 5002E MB MCP1700T5002EMB MCP1700T5002EMBTR ND MCP1700T5002EMBTRND MCP1700T5002EMBTR |
| Product | Manufacturers | Pack | D/C | ||||||||
| MCP1700T-5002E/MB | - | - | - |